WEST WARWICK – Mereco Technologies Group Companies Inc., a global supplier of specialty chemical products, has introduced a new, ultra-fast curing silver adhesive for cold soldering and bonding electrical components.
The Mereco Metaduct 1245 Silver Adhesive cures in 45 seconds at room temperature and is electrically conductive for cold soldering and bonding electrical and electronic components where regular soldering is impractical
The adhesive is a two part epoxy that provides over 600 psi tensile sheer strength when cured. According to the company, the 100 percent solid silver adhesive is a solvent-free, nonbleeding, thixotropic and nonflammable replacement to leaded and lead-free hot solder.
To meet exact user needs, Mereco can customize silver adhesive formulations that are nonthixotropic, cure at specific times up to several minutes and can be packaged for automated and manual dispensing.